60% Power Reduction in Inductive-Coupling Inter-Chip Link by Current-Sensing Technique ; K.Niitsu, N.Miura, M.Inoue, Y.Nakagawa, M.Tago, M.Fukaishi, H.Ishikuro and T.Kuroda ; International Conference on Solid State Devices and Materials (SSDM 2006) ; THE JAPAN SOCIETY OF APPLIED PHYSICS ; Yokohama, Japan ; ; 2006/09?
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