石黒、黒田、「3次元集積化のための積層チップ間非接触インター…
3次元集積化のための積層チップ間非接触インターフェース
A 2.5Gb/s/ch 4PAM Inductive-Coupling Transceiver for Non-Contact Memory Card,
S.Kawai, H. Ishikuro, and T. …
Contactless Interfaces in 3D-Integration,
H. Ishikuro, "Contactless Int…
Large Electron Addition Energy above 250 meV in the Silicon Quantum Dot in a Single Electron Transistor
Large Electron Addition Energy…
47% Power Reduction and 91% Area Reduction in Inductive-Coupling Programmable Bus for NAND Flash Memory Stacking,
M. Saito, Y. Yoshida, N. Miura…
Modeling and Experimental Verification of Misalignment Tolerance in Inductive-Coupling Inter-Chip Link for Low-Power 3-D System Integration,
K.Niitsu, Y. Kohama, Y. Sugimo…
2 Gb/s 15 pJ/b/chip Inductive-Coupling Programmable Bus for NAND Flash Memory Stacking,
M. Saito, Y. Sugimori, Y. Koha…
アナログ離散時間信号処理のための高線形かつ広帯域サンプリング回路
佐藤守、阿部寛之、黒田忠広、石黒仁揮、「アナログ離散時間信号…
A 90nm CMOS Highly Linear Clock Bootstrapped RF Sampler Operating at Wide Frequency Range of 0.5GHz to 5GHz,
M.Sato, H.Abe, M.Hamada, H.Ma…
A Wireless Real-Time On-Chip Bus Trace System,
S. Kawai, T. Ikari, Y. Takika…